Form:爱集微 2026/4/16Browse:413
According to the latest data from market research firm IDC, the global smartphone market declined for the first time since 2023 in the first quarter of this year. Tight storage supply and the impact of the war in Iran ha...
Form:爱集微 2026/4/15Browse:438
As AI chips have increasingly higher requirements for performance and integration, advanced packaging and substrate technologies have become crucial in semiconductor competition.Samsung Electro-Mechanics is reportedly bu...
Form:中国日报网 2025/1/20Browse:2188
With the birth of ChatGPT, competition in the field of artificial intelligence (AI) has entered the same heat.Nvidias high -end graphic processing unit (GPU) chip is fluttered by major technology companies.At the same ti...
Form: 2024/12/27Browse:2299
On December 20, the Open Artificial Intelligence Research Center (OpenAI) introduced its latest artificial intelligence (AI) reasoning model-O3 and its lightweight version of O3-Mini.The company claims that O3 has more a...
Form: 2023/8/9Browse:2630
Entering 2023, the industrial chain of the industrial control market in the background of Industrial 4.0 fully exerted its efforts to continuously accelerate the introduction of industrial manufacturing in the direction...
Form: 2023/5/24Browse:2447
Qorvo (Nasdaq Code: QRVO), the worlds leading connection and power solution supplier, announced that Qorvos 1.8 GHZ DOCSIS NBSP; 4.0 product portfolio has added new members.Qorvos QPA3314 hybrid power multiplier amplifi...
Form: 2023/5/19Browse:2403
According to statistics from TrendForce Ji State Consultation, the total shipments of MLCC suppliers from January to April this year were 1359 billion, a decrease of 34%compared with the same period of 2021, showing that...
Form: 2023/4/3Browse:2187
According to industry sources, the IC seal testing plant is urging the increase in production capacity in Southeast Asia, especially BGA packaging.According to the Taiwan Media Electronics Times, sources said that many i...
Form: 2023/3/14Browse:2536
The leading semiconductor component distribution dedicated to the Asia-Pacific market-Da Lianda University Holdings announced that its underworldShiping launchedMicro -source semiconductor (LPS) LP7810QVF, LP5305QVF, LPB...
Form: 2023/1/30Browse:2505
From the official shipment in May 2022, the customer has about 10 products based on the WTM2101 chip. The cooperative customers are mainly intelligent wearable device manufacturers who have higher requirements for comput...